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  ??esoldering??
  Take off the through-hole component from the board when do repair is quite difficult. If you do not take care of the take off process, it is very easy to damage the through-hole soldering pan and the conductive through-hole wall.
  
  S300 is designed for this application, helping take off the through-hole component safety and easy especially to the multi-lead-pin component and heavy thermal capacity component.
  
  Put the board on the board holder, select the right solder nuzzle, alight it to the target component pin, starting the solder pump, the solder will raise to the through-hole lead pin. In one wave programmed, the component is desoldered in couple of seconds. Then, you can take off it safety and easily. After that, you can use the air nuzzle press the board from above and blow off the solder dross leaving the through-hole in neatness.
  
  
  
  2. Specification
  Application    ??all through-hole component as IC, transform, connector,
  and so on
  Soldering process   ??lead or lead free
  PCB max.    ??600 x 500 mm
  Component length   ??max. 220 mm
  Soldering peak height  ??0 to 10 mm above nuzzle, programmable
  Solder pump    ??propeller driven by servo motor
  Lead free pump   ?? made by titanium??ptional??
  Control unit    ??PLC of Siemens??CD display of the parameter??mall key board as operate panel??oot switch
  Soldering peak high   ??programmable controlled by PLC
  Soldering wave up speed : programmable
  Soldering wave down speed : programmable
  Soldering time     : programmable
  Soldering temperature  ??PID close loop control by PLC Max. 380 Celsius
  Soldering process  ??Two modules, manual control or automatic program control One solder process can be divided into different section of soldering with different height and last time.
  Can be programmed one wave soldering and two times soldering like double wave soldering.
  Standard nuzzle  ????ptional??
  Special nuzzle   ??customer request design??ptional??ome nuzzle can be used t