Henchman Technology Limited

Company Description

Henchman Technology Limited IC packaging house especially in BGA, LGA, QFN, CSP, MCM, stacked dies, and other packaging with lead frames. We have a full range of facilities in our company and be able to do flip chip, COF and others. Fast delivery.

We can give you a proposal for how to pack an IC.  We can make samples for you for evaluation.  We provide one-stop service for your requirement. Please contact us when you have a project on hand. Project preview is free of charge.