MITSUYA CO.,LTD

Company Description

1. MITSUYA CO.,LTD take on challenging materials! Let us be your lab for new plating technology.

2. Introduction
Our firm was founded in 1931, and today we are pioneering manufacturers in surface treatment technologies, with 40% of the global share of plating services for automobile engine sensor parts. We are headquartered in Shinagawa-ku, Tokyo.

3. Our products
We boast advanced stainless steel plating technologies using gold, silver, copper, tin, and other materials. Our gold-plating technology was used for an experimental high reflectivity apparatus on NASA's space shuttle Endeavour.

4. Certifications and awards
Our quality control management system is ISO9001 certified, and our environmental management system is Eco Stage Stage 2 and KES Step 2 certified (equivalent to ISO14001).
In addition, we were selected by the Ministry of Economy, Trade, and Industry (METI) for its 300 Healthy Manufacturing SMEs: 2008 Edition.

5. Domestic performance and exports
We have a long track record working with major electronics manufacturers, and we work with 700 firms in Japan.
We also work with the R&D units at major automobile manufacturers to develop next-generation technologies.

6. Policies | Philanthropy | Greetings
Since its founding, Mitsuya has taken on every challenge, no matter the difficulty, to answer its customers' high-level needs. Customers praise us, saying Mitsuya is the place to bring their toughest challenges. We will continue strive to develop the best talent, new technologies, and quality control systems, while reducing our environmental footprint. All this is done to deliver cutting-edge new technologies and meet our customers' every need.

Company Information

  • Contact Person:Mr. Yasuhiro Chiba
  • Department:Sales
  • Telephone:
  • Fax:
  • Zip:141-0031
  • Province/State:Tokyo
  • City:Shinagawa-ku
  • Operational Address:3-8-11, Nishigotanda, Shinagawa-ku, Tokyo, Japan
  • Business Type:Manufacturer
  • Year Established:1959
  • Year Start Exporting:2010
  • Number Of Employees:301 - 500 People
  • Total Revenue:US$10 Million - US$50 Million
  • Average Lead Time:7 Day(s)
  • Trade Capacity:Domestic Market : 70.00% Eastern Asia : 10.00%
  • Production Capacity:Factory Size : 30,000-50,000 square meters No. of
  • R&D Capacity:No. of R&D Staff :31 - 40 People
  • Main Products:Electroplating,Electronics Parts,Automobile Parts,Plating,Indium Plating, Tin Plating,We Have Provided, Porous Plating, Nickel Plating,Wafer Plating, Zinc Plating,Plating On Powder Particles, Direct Plaing, Silver Plating,Zinc-nickel Alloy, Reel-to-reel Plaitng, Gold And Gold Alloy Plating,
  • Address:3-8-11, Nishigotanda
  • Main Markets:Domestic Market, Eastern Asia, Southeast Asia, Nor
  • Location:Tokyo, Japan
  • Website:Visit website

Product

  • Gold tin alloy plating for variety use made in Japan
  • High strength gold plating for Precision part and Surface treatment
  • High strength plating for Semiconductor and Surface treatment
  • High strength gold tin eutectic alloy plating for Electronics device a...
  • High strength gold plating for Precision equipment and Electronics dev...
  • High level partially electrolytic gold plating product formed with ree...
  • Gold-tin alloy plating which enables high temperature soldering in sur...
  • Gold-tin eutectic alloy plating used in hermetic packaging
  • Gold-tin alloy plating for solder connect which enables high connect r...
  • Gold-tin alloy plating which enables only demanded area metallization
  • Gold-tin alloy plating which enables high temperature soldering at sur...
  • Gold-tin eutectic alloy plating for modules which need hermetic seal
  • Gold-tin eutectic alloy plating which enables high intensity connectio...
  • Gold-tin alloy plating for hermetic aplication
  • Gold-tin eutectic alloy plating for radio-frequency module
  • Gold-tin eutectic alloy plating for laser mounting
  • Gold-tin eutectic alloy plating for brazing used in microelectronics f...
  • Whisker free solder using gold-tin eutectic alloy plating
  • Gold-tin alloy plating bump which enables high intensity connection
  • Excellent gold-tin alloy plating in the point of obtaining film more p...
  • Gold-tin eutectic alloy plating for high temperature solder applied to...
  • Gold-tin eutectic alloy plating for high temperature solder applied to...
  • Gold-tin eutectic alloy plating for high temperature solder applied to...
  • Gold tin alloy plating for soldering at surface mounting
  • Pin connector for performing joint reliably and accurately
  • Gold-tin eutectic alloy solder used in die bonding for high power lase...
  • Gold-tin eutectic alloy plating for soldering applied to laser devices
  • Gold-tin alloy plating for soldering applied to optoelectronics
  • Gold-tin eutectic alloy plating for electric contacts which need high ...
  • High strength Au-Sn eutectic alloy plating film for lead free solder
  • Lead free and high strength solder used gold tin eutectic alloy
  • Gold solder material for high temperature solder such as gold-tin eute...
  • Tin alloy for lead free and high temperature solder
  • Gold alloy plating applied to electronic component for high reliable c...
  • Eutectic alloy plating which has stability and uniform content if gold...
  • Gold-tin eutectic alloy plating for lead free and high temperature sol...
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