Shenzhen Anst Technology Co., Ltd

Company Description

ANST has whole assembly and test lines and 3000 set main machines.The assembly building is 25000 square meters and test building is10000 square meters. ANST has world-class IC assembly process andanalog, digital and mix-signal test process. After several yearsdevelopment, ANST has over 100 packages including DIP, SOP, SSOP,MSOP, QSOP, TSOT, QFP, QFN and Flip chip. Basing on developingtraditional IC assembly and test technology, ANST focus ondeveloping advanced assembly research and development. Shenzhen Anst Technology Co., Ltd developed50um 12inch wafer backgrinding and sawing process, high densitygold wire and copper wire wire bonding process, OCDIP, OCSOP, MEMS,FC-SOICFC-TSOTFC-QFN etc., and have many intellectualproperty.