Shenzhen Sinbond Electronic Materials Co., Ltd

Company Description

Adhesive for chip mounting machines SND series(红胶) Shenzhen Sinbond Electronic Materials Co., Ltd developed “SND series ”adhesive for chip mounting machines or SMD.They are one-part thermo-setting epoxy adhesive with the property of preservation stability, and are of 1 to 2 minute short time or high speed curability required for 120 to 150℃ heat-give SMD packaging.We are ready, in addition, to offer the adhesive of various grades with excellent micro-printability or with suitability for high-speed dispensers. Packaging:200gr、360gr, 10cc, 20cc, 30ccsyringes, 1000g is standard bottled Underfill Halogen-free High-Lead(Pb) Die-Attach Solder Paste（高铅锡膏） High lead, high melting point alloys, lead content is more than 85%. Can meet the RoHS directive. Usually used in package of power semiconductor device, can Miscibility with Au, Cu, AG, high residual impedance and good welding strength. The halogen-related failure mode for die-attach solder pastes is the corrosion of wirebond pads on the topside of Power Semiconductor die which are soldered to the leadframe with halogen-containing solder paste. Packaging: 35g is 10CC syringes, 100g is 30CC syringes, 500g is standard bottled, 1000g is bottled or syringes