Suzhou Runde New Material Co., Ltd.

Company Description

Building on Suzhou Runde New Material Co., Ltd. experience in the semiconductor industry, Runde has developed the line of adhesives, ingot support beams and guide wheels to accommodate the unique challenges of the wafering process. The rapidly changing technology of wafering requires continual development to meet these challenges. Our product development efforts have led to unique products including water resistant adhesive systems for wafering, simple heat release adhesives for monocrystalline ingot squaring, support beam technology compatible with fixed abrasive wire slicing. We continue to work closely with our customers to understand and meet their continually changing needs in this dynamic industry.

Company Information

Contact Person:Mr. Henry Bao
Department:Sales
Job Title:Department Manager
Telephone:
Mobile Phone:
Fax:
Zip:215600
Province/State:Jiangsu
City:Zhangjiagang
Operational Address:28 Zijing Road, Economic And Technological Development Zone, Zhangjiagang, Jiangsu, China (Mainland)
Business Type:Manufacturer, Trading Company
Year Established:2013
Year Start Exporting:2013
Number Of Employees:51 - 100 People
Total Revenue:US$1 Million - US$2.5 Million
Average Lead Time:10 Day(s)
Trade Capacity:Domestic Market : 70.00% Southeast Asia : 15.00%
Production Capacity:Factory Size : 3,000-5,000 square meters No. of Pr
R&D Capacity:No. of R&D Staff :5 - 10 People
Main Products:Resin Beam, Slicing Beam,Glass Plate,Epoxy Adhesive,Pulley,Slicing Beam,Slicing Beam For Semiconductor Silicon Wafers, Slicing Beam For Solar Silicon Wafers, Slicing Beam For Sapphire Wafers, Resin Beam Support, Glass Beam Support, Epoxy Adhesive,Pulley
Address:No.28 Zijing Road
Main Markets:Domestic Market, Southeast Asia, North America, Ea
Location:Jiangsu, China (Mainland)
Website:Visit website

Product

ISO9001 Certificated Slicing beam for semiconductor silicon wafer
ISO9001 Certificated Curving Slicing beam for semiconductor silicon wa...
Cutting dam-board and beam support for semiconductor silicon wafer
Glass slicing beam for semiconductor wafer wire sawing machine
Graphite Slicing beam for semiconductor silicon wafer
8 inches Slicing beam for semiconductor silicon wafer
8 inches Slicing beam for semiconductor silicon wafer
ISO9001 Certificated Slicing beam for semiconductor silicon wafer
Curving Glass slicing beam for semiconductor wafer wire sawing machine
380mm diameter Slicing beam for semiconductor silicon wafer
Glass Slicing beam for solar wafer wire sawing process
Notched Glass Slicing beam for solar wafer wire sawing process
Epoxy Adhesive for silicon ingot mounting system RD639
Wearable Polyurethane Pulley for NTC MB Muti-wire sawing machines
Resin beam for LED Sapphire sawing
Steel Guild wheel for Meyer Burger Muti-wire sawing machines
Diamond wire sawing Slicing beam NTC supplier
Special Slicing beam for solar wafer diamond wire sawing process
cutting dam-board for solar wafer
Resin beam for Sapphire Iphone camera head
Flat Glass plate for LED Sapphire sawing
mounting plate for sapphire rod
Glass Plate for LED Sapphire slicing
ISO9001 Certificated Resin beam support for semiconductor silicon wafe...
ISO9001 Certificated Curving Resin Beam support for semiconductor sili...
8 inches Resin beam support for semiconductor silicon wafer
380mm diameter Resin beam support for semiconductor silicon wafer
Cutting dam-board and beam support for semiconductor silicon wafer
Special Resin beam support for solar wafer diamond wire sawing process
Diamond wire sawing resin beam support NTC supplier
Resin beam support for LED Sapphire sawing
mounting plate for sapphire rod
Resin beam support for Sapphire Iphone camera head
Curving Glass slicing beam for semiconductor wafer wire sawing machine
Glass slicing beam for semiconductor wafer wire sawing machine
Glass Slicing beam for solar wafer wire sawing process

Category

Countries

United States All Countries