Company Information
- Contact Person:Mr. Ken Wu
- Telephone:
- Business Type:Trading Company
- Trade Capacity:- -
- Production Capacity:- -
- Main Products:High Power LED
- Location:Taiwan
Product
- RF Testing Equipment
- Metal Lid
- Wafer Grinding tool
- Dicing Saw Components
- Assembly Packaging machine- SMT (06)
- Flip Chip
- Assembly Packaging - C4 Flip Chip
- GGI Flip Chip
- Thick Film Substrate
- Substrate plate
- Outsourced Substrate
- Copper Lead Frame Substrate
- Thin Film Substrate
- Thin Film Substrate
- Thin Film Substrate